- October 19, 2023
- Posted by: legaleseblogger
- Category: Related News
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Intel’s Future Technologies and TSMC’s Competing Processes
Intel, known for its advanced fabrication technologies, is set to release the 20A (2nm-class) and 18A (1.8nm-class) manufacturing processes ahead of TSMC. However, TSMC, the world’s largest chip producer, is confident that its N3P (3nm-class) technology will possess comparable characteristics to Intel’s 18A, and its N2 (2nm-class) technology will outperform Intel in terms of power, performance, and area (PPA) advantages.
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TSMC’s CEO, C.C. Wei, stated during the earnings call that their N3P technology not only demonstrates comparable PPA to Intel’s 18A but also possesses an earlier time to market, superior technology maturity, and more cost efficiency. Furthermore, Wei emphasized that TSMC’s N2 technology, without backside power, surpasses both N3P and 18A in advancement and will become the industry’s most advanced technology upon its release in 2025.
On the other hand, Intel’s 20A fabrication technology, expected in 2024, introduces groundbreaking RibbonFET gate-all-around transistors and backside power delivery network (BSPDN). These innovations aim to enhance performance, reduce power consumption, and increase transistor density. Intel’s 18A production node, slated for late 2024 or early 2025, will further refine the innovations introduced in 20A, offering additional PPA improvements.
In contrast, TSMC’s 3nm-class processes, including N3, N3E, N3P, and N3X, rely on proven FinFET transistors and traditional power delivery networks. TSMC seems to be less focused on nanosheet GAA transistors and BSPDN, with plans to introduce them in their N2 and N2P nodes, respectively. The high-volume production for N2 is expected in the second half of 2025, while N2P’s mass production will commence in late 2026.
Intel’s main objective in the coming years is to surpass TSMC in technology leadership and secure foundry orders from companies that require cutting-edge nodes. To achieve this, Intel plans to launch three advanced manufacturing processes within the next five quarters and initiate volume production of their 2nm and 1.8nm-class technologies between the second half of 2024 and the first half of 2025. However, TSMC believes that even their N3P node in 2025 will offer comparable PPA to Intel’s 18A at a lower cost, while their N2 node will surpass it, albeit a year later.
Although further details about TSMC’s N3P and N2 technologies have not been disclosed, it is evident that TSMC possesses great confidence in their upcoming process nodes. This is where the AI legalese decoder can prove valuable, allowing professionals to understand the intricate technical details and potential advantages of TSMC’s future technologies compared to Intel’s offerings.
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